AT24C128/256
AT24C128 Ordering Information (1)
Ordering Code
AT24C128-10PU-2.7 (2)
AT24C128-10PU-1.8 (2)
AT24C128N-10SU-2.7 (2)
AT24C128N-10SU-1.8 (2)
AT24C128W-10SU-2.7 (2)
AT24C128W-10SU-1.8 (2)
AT24C128-10TU-2.7 (2)
AT24C128-10TU-1.8 (2)
AT24C128U2-10UU-1.8 (2)
AT24C128Y1-10YU-1.8 (2)
AT24C128Y4-10YU-1.8 (2)
AT24C128-W1.8-11 (3)
Package
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8U2-1
8Y1
8Y4
Die Sale
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
(–40 ° C to 85 ° C)
Industrial Temperature
(–40 ° C to 85 ° C)
Notes:
8P3
8S1
8S2
8U2-1
8Y1
8Y4
8A2
– 2.7
– 1.8
1. This device is not recommended for new design. Please refer to AT24C128B datasheet. For 2.7V devices used in the 4.5V to
5.5V range, please refer to performance values in the AC and DC characteristics tables.
2. “U” designates Green package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL788 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-ball, die Ball Grid Array Package (dBGA2)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
Options
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 3.6V)
13
0670T–SEEPR–3/07
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